Multicore X33-12i is a no-clean, resin free and halide free liquid flux for surfaces with poor solderability.
Maximum process window and sustained activity – without resin
High speed soldering on conventional leaded and SMD
components – no bridges or icicles
Good through-hole penetration
No cleaning – reduces costs
Compatible with resin and OSP based surface preservatives
Easy to applicate as foam, spray or wave methods