Multicore MP100 is a high speed printing, no clean and pin testable solder paste. It is a pale, soft residue product for printing and reflow in air, where process yield is critical. Multicore MP100 is a state-of-the-art solder paste that is safely used in the most critical soldering applications.
MP100 solder pastes offer excellent open time and greatly extended abandon times. They ensure good soldering activity over a wide range of reflow profile types and surface finishes. The MP100 paste contains Type 3 (AGS) solder powder, which is formulated for high volume stencil printing applications with component lead pitches down to 0.4mm. Its flux is formulated to provide excellent wetting on all common board and component lead finishes, including OSP copper that may have been passed through multiple reflow processes in air.